Sisma renews its design for the new generation of laser system for microprocessing with fiber technology. Increased functionality of the source allow engraving, marking and microcutting to meet the highest technical standards available. Door opens on 3 sides to facilitate access, wide work chamber (500x500 mm), maximum height of piece 530 mm (F100) and can be connected with all Sisma accessories making the system highly flexible. Awareness of the process and applicative requirements, as well as constructive features, make the Big Smark an innovative system simple and productive.
Control: Windows PC. Software SLC - PRISMA
Interface: PLC, data network (ethernet), digital I/O
Software: Software for files management and marking parameters defining. Types of accepted files: Svg, Dxf, Hpgl, Bmp, Jpg, Pit; control system for axis; camera for object centering and positioning engraving cycles. Entirely developed in Sisma.
Options: High precision rotary axis, dragging system with winder, dynamic measuring device, fumes aspirator, static clamping device.
BIG SMARK 200F
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK 400F
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
0,16-1,33 mJ |
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK 500F
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK 700F
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK 200F EP
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
0,03-1 mJ |
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK 300F
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK 1000F
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
CW 1÷500 kHz |
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK GREEN
| Laser source |
|
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
≤ 1,2 M² |
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
| F100, F160 (standard), F254, F330 |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
BIG SMARK UV
| Laser source |
Nd:YV04 |
| Wavelength |
|
| Average laser power |
|
| Pulse frequency |
|
| Pulse duration |
|
| Max pulse energy |
|
| Beam quality |
|
| Laser spot diameter |
|
| Max marking speed |
|
| Focal lenses |
|
| 4th axes |
|
| Guide laser |
| Class 2M Red Laser Diode; λ=650 nm; 2 mW |
|
| Working temperature |
|
| Cooling system |
|
| Working chamber |
500 x 500 x 380 mm |
| Power supply |
230 V ± 15% 50/60 Hz 1ph 0,8 kW |
| Dimensions (WxDxH) |
650 x 1040 x 1760 mm |
| Weight |
640 kg |
